发明名称 |
MOLDED ARTICLE FOR PACKAGING ELECTRONIC PART |
摘要 |
PROBLEM TO BE SOLVED: To provide a container which is suitable for preventing a static electricity breakdown of an electronic part from occurring. SOLUTION: This molded article for packaging the electronic part contains a graft copolymer wherein a styrene based polymer and/or an acrylic ester base polymer are grafted on an olefin based polymer.
|
申请公布号 |
JP2002068281(A) |
申请公布日期 |
2002.03.08 |
申请号 |
JP20000262226 |
申请日期 |
2000.08.31 |
申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
MIYAGAWA KENJI;OGITA KATSUHISA |
分类号 |
B65D65/02;B32B27/32;B65D73/02;C08F255/00;C08J5/00;(IPC1-7):B65D65/02 |
主分类号 |
B65D65/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|