发明名称 MOLDED ARTICLE FOR PACKAGING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a container which is suitable for preventing a static electricity breakdown of an electronic part from occurring. SOLUTION: This molded article for packaging the electronic part contains a graft copolymer wherein a styrene based polymer and/or an acrylic ester base polymer are grafted on an olefin based polymer.
申请公布号 JP2002068281(A) 申请公布日期 2002.03.08
申请号 JP20000262226 申请日期 2000.08.31
申请人 DENKI KAGAKU KOGYO KK 发明人 MIYAGAWA KENJI;OGITA KATSUHISA
分类号 B65D65/02;B32B27/32;B65D73/02;C08F255/00;C08J5/00;(IPC1-7):B65D65/02 主分类号 B65D65/02
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