发明名称 SPUTTERING TARGET AND SPUTTERING APPARATUS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To diminish the generation of dust by effectively preventing spalling and falling of re-coated material, which is adhered and piled between a peripheral target body and a target hold-down jig in a sputtering target. SOLUTION: This sputtering target is equipped with a target body 11 having a step part 13 in peripheral side, a packing plate 12 supporting a lower side of this target body 11, and a target hold-down jig 14, laid out outside of peripheral target body 11, holding the step face 13a of the step part 13 of the target body 11. A concave dust-suppressing part 17 is formed on the step face 13a of the step-wise part 13 installed in the peripheral target body 11, or is formed on the differential step face 13b of this step part 13.
申请公布号 JP2002069610(A) 申请公布日期 2002.03.08
申请号 JP20000261377 申请日期 2000.08.30
申请人 TOSHIBA CORP;TOSHIBA ELECTRONIC ENGINEERING CORP 发明人 YABE YOICHIRO;ISHIGAMI TAKASHI;WATANABE KOICHI;WATANABE TAKASHI;FUJIOKA NAOMI;KOSAKA YASUO;SUZUKI YUKINOBU
分类号 C23C14/00;C23C14/34;H01L21/203;(IPC1-7):C23C14/00 主分类号 C23C14/00
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