| 摘要 |
<p>A packaged solid state device having a package, a chip (4), and an encapsulate having an epoxy resin, a boron containing catalyst that is essentially free of halogen. A LED (1, 2, 3) device having a package, a LED chip (4), a encapsulate having a cycloaliphatic epoxy resin and a boroxine catalyst essentially free of halogen. A method of encapsulating a solid state device whereby a solid state device is placed into a package, and an encapsulant comprising an epoxy resin, and a boron containing catalyst that is essentially free of halogen, are provided.</p> |
