发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A technique for attaining a large capacity of a memory card type semiconductor device is provided wherein a flexible substrate with electronic components mounted thereon is folded and received within a case. CONSTITUTION: A Cu pattern is formed centrally of a bending portion(BAL) on a flexible substrate and Cu patterns are formed at end portions of mounting areas located on both sides of the bending portion. When the flexible substrate is bent along the bending portion(BAL), only film exposed portions present on both sides of the Cu pattern are bent with a small radius of curvature and the end portions of the mounting areas and the vicinities thereof are kept flat. |
申请公布号 |
KR20020017965(A) |
申请公布日期 |
2002.03.07 |
申请号 |
KR20010048912 |
申请日期 |
2001.08.14 |
申请人 |
HITACHI TOHBU SEMICONDUCTOR, LTD;HITACHI.LTD. |
发明人 |
SHINOHARA MINORU |
分类号 |
H05K1/02;H01L23/12;H01L25/10;H01L25/11;H01L25/16;H01L25/18;H05K1/00;H05K1/18;(IPC1-7):H01L23/12 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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