| 发明名称 |
Method for manufacturing circuit devices |
| 摘要 |
After mounting portions (65) are formed in each block (62), circuit elements are mounted on the mounting portions (65) and molded with insulating resin (50). Then, the back surface of conductive foil (60) is etched to form conductive patterns 51in each block. Further, a plurality of blocks are bonded onto a adhesive sheet so that a testing step and a dicing step are carried out upon the blocks in a lump.
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| 申请公布号 |
US2002028525(A1) |
申请公布日期 |
2002.03.07 |
| 申请号 |
US20010944322 |
申请日期 |
2001.08.31 |
| 申请人 |
SAKAMOTO NORIAKI;KOBAYASHI YOSHIYUKI;SAKAMOTO JUNJI;OKADA YUKIO;IGARASHI YUSUKE;MAEHARA EIJU;TAKAHASHI KOUJI |
发明人 |
SAKAMOTO NORIAKI;KOBAYASHI YOSHIYUKI;SAKAMOTO JUNJI;OKADA YUKIO;IGARASHI YUSUKE;MAEHARA EIJU;TAKAHASHI KOUJI |
| 分类号 |
H01L21/48;H01L21/66;H05K1/18;H05K3/06;(IPC1-7):H01L21/66;G01R31/26;H01L21/336 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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