发明名称 Enhanced plasma mode and system for plasma immersion ion implantation
摘要 A novel plasma treatment method (800, 814). The method includes forming an rf plasma discharge in a vacuum chamber. The plasma discharge includes an inductive coupling structure, which has a first cusp region at a first end of the structure and a second cusp region at a second end of the structure. In some embodiments, a third cusp region, which is between the first and second cusp regions, can also be included. The first cusp region is provided by a first electro-magnetic source and the second cusp region is provided by a second-electro magnetic source. The first electro-magnetic source and the second electro-magnetic source confines a substantial portion of the rf plasma discharge to a region away from a wall of the vacuum chamber. Accordingly, a plasma discharge is substantially a single ionic species (e.g., H1+) can be formed.
申请公布号 US2002027205(A1) 申请公布日期 2002.03.07
申请号 US20010875815 申请日期 2001.06.05
申请人 LIU WEI;BRYAN MICHAEL A.;ROTH IAN S. 发明人 LIU WEI;BRYAN MICHAEL A.;ROTH IAN S.
分类号 C23C14/48;H01J37/32;(IPC1-7):H01L21/461 主分类号 C23C14/48
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