RESIN COMPOSITION, MOLDED OBJECT THEREOF, AND USE THEREOF

摘要

A resin composition which comprises (A) at least one heat-resistant thermoplastic resin selected among polyketone resins, polyimide resins, polyethernitriles, polybenzimidazole, polyphenylene sulfide, polysulfones, polyethersulfones, polyarylates, liquid-crystal polyester resins, and 1,4-polyphenylene and (B) a flaky inorganic filler which (1) has a Mohs' hardness of 3.0 or lower, (2) has a coefficient of linear expansion of 5.0x10<-5> /K or lower, (3) retains chemical inertness and a layer structure at temperatures not higher than at least 500 DEG C, and (4) has an aspect ratio (ratio of the average particle diameter to the thickness) of 10 or higher; a molded object of the resin composition; and as a use thereof a base film for printed circuit boards.