发明名称 High-density electrical interconnect system
摘要 An electrical interconnect system includes an insulative substrate, and a plurality of groups of electrically conductive contacts arranged on the substrate. The contacts are electrically isolated from one another, and the groups are interleaved among one another in a nested configuration. The system also includes a plurality of receiving-type interconnect components each for receiving one of the groups of contacts within that component. The nested configuration of the groups of contacts maintains the contacts in close proximity to one another and, at the same time, allows adequate clearance between the contacts so that each group may be received within one of the receiving-type interconnect components.
申请公布号 US2002028589(A1) 申请公布日期 2002.03.07
申请号 US20010765305 申请日期 2001.01.22
申请人 CRANE STANFORD W. 发明人 CRANE STANFORD W.
分类号 H01R13/11;H01R4/24;H01R12/16;H01R12/22;H01R13/02;H01R13/03;H01R13/04;H01R13/193;H01R13/26;H01R24/00;H01R24/02;H05K1/00;(IPC1-7):H05K1/00 主分类号 H01R13/11
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