发明名称 MULTILAYER RETAINING RING FOR CHEMICAL MECHANICAL POLISHING
摘要 A carrier head (100) for a chemical mechanical polishing apparatus includes a retaining ring (110) having a flexible lower portion (108) and a rigid upper portion (184). A shim (202) can be inserted between the retaining ring (110) and a base (104) of the carrier head to improve the retaining ring (110) lifetime. A seal (200) may be inserted between the retaining ring (110) and a flexible membrane to seal the chamber (190) between the flexible membrane and the base.
申请公布号 WO0189763(A3) 申请公布日期 2002.03.07
申请号 WO2001US16194 申请日期 2001.05.17
申请人 APPLIED MATERIALS, INC. 发明人 WANG, JUNSHI;ZUNIGA, STEVEN, M.
分类号 B24B37/32;H01L21/304 主分类号 B24B37/32
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