| 摘要 |
<p>A polishing device, wherein, when a wafer (2) is polished, the guide face (5a) of a ring-shaped guide member (5) is raised by an air cylinder (15) to a position generally flush with the polishing surface of the wafer (2) held by a holding part (3) and the guide face (5a) supports the extruded portion of a polishing body (7) and, when the wafer (2) is loaded onto and unloaded from the loading part (3), the guide member (5) is moved downward by the air cylinder (15) to take shelter at a position not interfered with the holding part of a wafer transporting device, whereby, when a polished article is loaded and unloaded by using the transporting device having the holding part holding the outer peripheral part of the polished article, the polished article can be polished more uniformly and the wear of the polishing body can be reduced.</p> |
