METHOD OF THINNING SEMICONDUCTOR WAFER CAPABLE OF PREVENTING ITS FRONT FROM BEING CONTAMINATED AND BACK GRINDING DEVICE FOR SEMICONDUCTOR

摘要

PURPOSE: A method of thinning a semiconductor wafer is provided to enhance the quality and reliability of a semiconductor device by eliminating the contamination of the wafer surface. CONSTITUTION: A protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.