发明名称 Solution treatment apparatus
摘要 In a solution treatment apparatus, a nozzle for discharging a treatment solution toward a substrate held by a spin chuck includes a discharge opening for discharging the treatment solution on a surface of the substrate. A collision body against which the treatment solution discharged from the nozzle collides is disposed between the discharge opening of the nozzle and the substrate. Since the collision body is disposed between the discharge opening and the substrate, even when the discharge pressure of the treatment solution is high, the discharged treatment solution once collides against the collision body so that the discharge speed on reaching the substrate is reduced, damage to the substrate is eased, and the amount of air entering into the discharged treatment solution is decreased. Accordingly, no micro-bubble occurs.
申请公布号 US2002026896(A1) 申请公布日期 2002.03.07
申请号 US20010908889 申请日期 2001.07.20
申请人 TAKEKUMA TAKASHI 发明人 TAKEKUMA TAKASHI
分类号 B05B1/20;B05C5/00;B05C11/02;B05C11/08;H01L21/00;(IPC1-7):B05C5/00 主分类号 B05B1/20
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