发明名称 AN EXPOSED PADDLE LEADFRAME FOR SEMICONDUCTOR DIE PACKAGING
摘要 <p>According to one embodiment, a leadframe (300) having at least one tab (320) is placed inside a mold cavity (350). During the molding process, the ceiling (354) of the mold cavity is pressed against the at least one tab (320), which in turn causes a bottom surface of the leadframe to be pressed firmly against a floor (358) of the mold cavity. When a mold compound (336) is injected into the mold cavity (350), the mold compound is prevented from reaching under the bottom surface of the leadframe (300). The tabs (320, 322, etc.) are then mechanically formed at a nonzero angle with respect to a plane of a frame (301) of the leadframe (300).</p>
申请公布号 WO2002019413(A1) 申请公布日期 2002.03.07
申请号 US2001026044 申请日期 2001.08.20
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