| 摘要 |
<p>The invention aims at providing a collective filling device for through holes in a substrate with a resin or any insulating or conductive product. The invention concerns a collective method for flush filling of through holes (2) in a substrate (1) with a product (3) using a doctor blade (7) of any closed device (4) relatively moving in translation on a first surface of the substrate to drive into said holes the product (3) and to obtain levelling of the first surface, and protrusion on the second surface. The invention is characterised in that the scraper device (8) consists of two flexible lips (9) facing each other and forming with the substrate an angle α not less than 90° in the scraping zone forming a container of the sheared product and said scraper device is moved simultaneously with the blade (7) or with the closed device (4), such that the transfer occurs in the zone located between the two lips (9) of the scraper device.</p> |
