| 摘要 |
PURPOSE: An apparatus for uniformly plating a substrate is provided which prevents generation of plating deviation during etching, thereby forming a uniformed plating layer on the substrate by installing an etching device so that etching is sequentially performed from the central part to the outer side so as to prevent non-etching problems. CONSTITUTION: The apparatus for uniformly plating a substrate comprises a substrate upper etching part(100) in which etchant spray nozzles(110) are arranged in a concyclic shape on the bottom surface of an upper base(140); a substrate lower etching part(200) which is oppositely installed to the substrate upper etching part(100), and etchant spray nozzles(210) are projected from the upper side of a lower base(220) so that they are positioned at the central parts of dense patterns(300) of a substrate(230) respectively; and a substrate fixing part(300) in which a plurality of supporting rollers(330) are integrally installed on the inner side surface of a frame(310) into which the substrate(230) is inserted; wherein spray devices at the outer side of which air ejection nozzles are equipped are integrally installed in the etchant spray nozzles(110), the spray devices are installed so that the etchant is sequentially sprayed from the central part toward the outskirts, and a sensor is installed at one side of the upper base(140) so as to sense whether the substrate(230) is entered into the apparatus or not.
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