| 摘要 |
PURPOSE: A semiconductor device is provided in which a difference in coefficient of thermal expansion between a board and chip is absorbed. CONSTITUTION: A semiconductor device having a substrate on which a plurality of semiconductor chips are stacked, comprises a first semiconductor chip mounted on the substrate, a plurality of second semiconductor chips size of which are larger than that of the first semiconductor chip and stacked on the first semiconductor chip with a size-increasing order, a bonding pad formed on the semiconductor chip, a circuit pattern formed on the substrate, a bonding wire for connecting the bonding pad formed on the semiconductor chip and the circuit pattern formed on the substrate, a through hole, formed on the substrate, through which the bonding wire is to be inserted, and further wherein the bonding wire is wired so as to be substantially perpendicularly to a surface of the semiconductor chip. |
