| 摘要 |
PURPOSE: A method of manufacturing a semiconductor device is provided to achieve high production yield. CONSTITUTION: A method of manufacturing a semiconductor device comprises a step of (a) preparing a substrate in which a plurality of electrode members are individually placed on one main surface thereof in separated form, (b) a step of placing a semiconductor chip on the one main surface of the substrate and electrically connecting a plurality of electrodes formed on one main surface of the semiconductor chip and the plurality of electrode members respectively, (c) a step of forming a resin encapsulater for sealing the semiconductor chip and the plurality of electrode members on the one main surface of the substrate, and (d) a step of separating the semiconductor chip and the plurality of electrode members from the substrate together with the resin encapsulater. |
