发明名称 |
Microwave module comprising substrate with HF and LF layers forming distribution network structures, includes intervening insulating layer |
摘要 |
The high frequency structure layer (4) is separated from the low frequency structure layer (3) by the insulating layer (1). An Independent claim is included for the method of manufacture, which especially employs fine pitch flip-chip technology for bonding to the substrate. |
申请公布号 |
DE10041770(A1) |
申请公布日期 |
2002.03.07 |
申请号 |
DE2000141770 |
申请日期 |
2000.08.25 |
申请人 |
SIEMENS AG |
发明人 |
DABEK, ALEXANDER;HEIDE, PATRIC |
分类号 |
H01L23/498;H01L23/538;H01L23/66;H05K1/00;H05K1/02 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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