METHOD FOR PROCESSING BALL GRID ARRAY SUBSTRATE

摘要

PURPOSE: A method for processing a ball-grid-array(BGA) substrate is provided to eliminate the necessity for an additional apparatus for processing the appearances of the BGA substrate, by using a router in forming an open region of the BGA substrate so that the first and second processes are performed regarding the appearances of the BGA substrate to separate a plastic strip having a plurality of BGA substrates into individual BGA substrates. CONSTITUTION: A plurality of BGA substrates(1) where a semiconductor chip is mounted are formed in the plastic strip. The opening(15) of each BGA substrate and a part of the four sides of the BGA substrate are firstly processed by using the router. The rest of the four sides of the BGA substrate is secondly processed by using the router to divide the plastic strip into individual BGA substrates.