| 发明名称 |
Mit einem Fenster versehenes nicht-keramisches Gehäuse mit einem eingebetteten Rahmen |
| 摘要 |
An integrated circuit (IC) package includes a mold compound (12), a die (16), and a window (34). The mold compound (12) has a frame (32) embedded within it. The frame (32) has a coefficient of thermal expansion that is less than the mold compound (12). The IC package is capable of being attached to a circuit board via a mass reflow process. |
| 申请公布号 |
DE19983826(T1) |
申请公布日期 |
2002.03.07 |
| 申请号 |
DE1999183826T |
申请日期 |
1999.11.23 |
| 申请人 |
INTEL CORP., SANTA CLARA |
发明人 |
LI, ZONG-FU;SENGUPTA, KABUL;THOMPSON, DEBORAH L. |
| 分类号 |
H01L23/08;H01L23/02;H01L23/057;H01L23/24;H01L23/28;H01L23/48;H01L23/52;H01L29/40;H01L31/0203;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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