Optical semiconductor device package and optical semiconductor module having the same

摘要

An optical semiconductor device module includes an optical semiconductor device package, an optical semiconductor device such as a laser diode accommodated in the package, and a cooling device such as a Peltier device solder-joined to a solder joint area on an inner face of a metal bottom plate of the package and operable to cool the optical semiconductor device. A groove permitting molten solder to flow therein is formed in at least part of the solder joint area on the inner face of the metal bottom plate.