Multi-chip module made of a low temperature co-fired ceramic and mounting method thereof

摘要

A module for mounting chips therein includes base layers for forming floors on which the chips are mounted and cavity layers having cavities through which the chips are mounted on the floors. The floors has a top surface provided with contact regions for electrical connection with the chips and the cavity layers has a top surface provided with bonding pads for electrical connection with a printed circuit board. The cavity layers are disposed on the top surface of the base layers to expose the contact regions through the cavities.