发明名称 CONNECTION STRUCTURE FOR CONNECTING DISPLAY MODULE AND PRINTED SUBSTRATE BY USING SEMICONDUCTOR DEVICE
摘要 PURPOSE: Connection structure for connecting a display module and a printed substrate is provided to use a display module in mass production of electronic devices and to realize thin mounting. CONSTITUTION: In the electronic devices such as a cellular phone, a thin mounting is desired. Many components are mounted on a printed substrate(15) and a display module is required to be mounted in predetermined space on the printed substrate. A liquid crystal module(1) is provided with a pin electrode(6) on an external connection terminal of its COF(3), and fixed to a housing(7) in a folded state with respective rear surfaces of the COF and a liquid crystal panel(2) facing each other. A holding member(11) for engaging the printed substrate and holding the printed substrate is formed on the housing. When the holding member engages the printed substrate, the liquid crystal module is fixed to the printed substrate, and at the same time, the pin electrode of the COF and a through hole electrode of the printed substrate are electrically connected.
申请公布号 KR20020018082(A) 申请公布日期 2002.03.07
申请号 KR20010052274 申请日期 2001.08.29
申请人 SHARP CORPORATION 发明人 CHIKAWA YASUNORI;SATOU KUNIHIRO;TOMOKUNI HIROAKI
分类号 G02F1/1333;G02F1/13;G02F1/1345;G09F9/00;H01R12/12;H04M1/02;H05K1/14;H05K1/18;H05K3/30;H05K3/36;H05K7/14;(IPC1-7):H01R12/12 主分类号 G02F1/1333
代理机构 代理人
主权项
地址