| 摘要 |
The invention relates to the production of semiconductor chips with thin layer technology. An active layer (2) is grown on a substrate, with contact layers on the rear face thereof, comprising a base layer (3), reinforced by a reinforcing layer (4) the total thickness of which is at least as thick as the active layer (2). Finally an auxiliary support layer (5) is produced, which permits the further processing of the active layer (2). The reinforcing layer (4) and the auxiliary support layer (5) replace the mechanical support used in conventional methods.
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