| 摘要 |
PURPOSE: An apparatus for cleaning a substrate is provided to more efficiently clean the entire surface of a wafer within a short interval of time without re-applying contamination, which has been once removed from the surface of the substrate, to the surface of the substrate again, by using two different scrub heads. CONSTITUTION: The first scrub head(31) is superior to the second scrub head(32) in terms of a capability of removing contamination. The second scrub head has a low level of adhesion to the contamination as compared with the first scrub head. The first and second scrub heads are moved such that the second scrub head follows the first scrub head.
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