发明名称 Method and apparatus for cutting high viscosity liquid material
摘要 Method and apparatus for cutting high viscosity liquid material, said apparatus comprising a cylinder divided into upper and lower tanks by a partition with a central discharge opening, a moveable and elevatable liquid supply pipe with a distal end positioned opposite the discharge opening, the liquid supply pipe being mounted so that it can be raised until its distal end contacts the partition around the discharge opening, and then lowered until there is no contact, means for raising and lowering the liquid supply pipe, the upper tank having peripheral injection ports for injecting a low viscosity liquid into the upper tank, means for feeding high viscosity liquid material into the lower tank and flowing it into the upper tank, means for feeding low viscosity liquid into the liquid supply pipe and for feeding low viscosity liquid into the peripheral injection ports, the high viscosity liquid material flowing from the lower tank into the upper tank when the liquid supply pipe is lowered, the high viscosity liquid material being pushed upwardly into the upper tank by the low viscosity liquid when the liquid supply pipe is raised, whereby the high viscosity liquid material being pushed upwardly in the upper tank is cut into blocks by the low viscosity liquid being injected into the upper tank.
申请公布号 US6353033(B1) 申请公布日期 2002.03.05
申请号 US20000628468 申请日期 2000.07.31
申请人 DOW CORNING TORAY SILICONE CO., LTD. 发明人 OZAKI KOICHI;IMAIZUMI TORU;ISHIDA KOICHI;YAMADERA TOYOHIKO;HAMADA MITSUO
分类号 B01J4/00;B26F3/00;C08J3/12;F16K1/02;F17D1/08;F17D1/14;(IPC1-7):B01F17/00 主分类号 B01J4/00
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