PROCESSING DEVICE OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To restrict a suction of a processing liquid such as a coolant to a negative pressure system for adsorbing a wafer in a processing device of semi conductor wafer constituted such that the wafer is suctioned and retained on a rotation table by a negative pressure. SOLUTION: An adsorption pad 5 formed by a porous material so as to adsorb a semiconductor wafer 1 is coaxially buried on an upper surface part of the rotation table 2 so as to constituted an upper surface of the rotation table 2. A negative pressure passage 15 for acting a suction negative pressure over a whole lower surface of the adsorption pad 5 is provided in the rotation table 2. The rotation table 2 is constituted such that a pressurized air is upwardly injected from a released upper surface of the adsorption pad 5 including a border of an outer periphery of the wafer 1.