发明名称 |
Proper choice of the encapsulant volumetric CTE for different PGBA substrates |
摘要 |
The present invention describes a method and apparatus for packaging a flip chip by matching the z-direction CTE of the IC solder joint with the z-direction CTE of the encapsulant. Consideration of the z-direction CTE's is important when determining the volumetric CTE of the encapsulant. This invention first requires a determination of the z-direction CTE of the IC solder joint and a determination of the z-direction CTE of the encapsulant. The invention next matches the z-direction CTE of the IC solder joint to the z-direction CTE of the encapsulant. The matching of the two z-direction CTE's reduces the z-direction tensile or compression stresses on the IC solder joint and the encapsulant.
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申请公布号 |
US6353182(B1) |
申请公布日期 |
2002.03.05 |
申请号 |
US19980050765 |
申请日期 |
1998.03.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHANG CHI SHIH;CHEN WILLIAM T.;TRIVEDI AJIT |
分类号 |
H01L21/56;H01L23/498;H05K1/02;H05K1/11;H05K3/42;H05K3/46;(IPC1-7):H01L23/28;H05K5/06 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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