发明名称 METHOD FOR MANUFACTURING CARRIER TAPE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a carrier tape by a vacuum forming method capable of forming housing recessed parts, each of which houses a package of an electronic part or the like, without deforming the same. SOLUTION: In the method for manufacturing the carrier tape, the recessed parts 31 is formed for housing the electronic parts or the like to a thermoplastic sheet 20 after being softened under heating, by the vacuum forming method using a mold 10 having vacuum suction holes 12. Air is supplied from the suction holes 12 of the mold 10 after the recessed parts 31 are formed to the sheet 20 by the vacuum forming method, to release the sheet 30 having the recessed parts 31 formed thereto from the mold 10.
申请公布号 JP2002067140(A) 申请公布日期 2002.03.05
申请号 JP20000259066 申请日期 2000.08.29
申请人 SHIN ETSU POLYMER CO LTD 发明人 IMAI HIROSHI
分类号 B65D85/86;B29C51/10;B29C51/44;B29L7/00;B29L31/00;(IPC1-7):B29C51/44 主分类号 B65D85/86
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