Process for producing BGA type semiconductor device, TAB tape for BGA type semiconductor device, and BGA type semiconductor device

摘要

"<CUSTOM-CHARACTER FILE="US06353259-20020305-P00001.TIF" ID="CUSTOM-CHARACTER-00001">"-shaped slits and linking portions are previously provided so as to surround a semiconductor chip-mounting region in a TAB tape. A semiconductor chip is applied onto the semiconductor chip-mounting region. The semiconductor chip in its electrode pad is connected by bonding to the TAB tape in its inner lead. The bonded connection is subjected to plastic molding. Solder balls are provided on the backside of the TAB tape in its portion corresponding to the semiconductor chip-mounting portion. Thereafter, the package portion is cut off at the cutting position in the linking portion of the slits. By virtue of the above constitution, highly reliable BGA type semiconductor devices can be produced while reducing the thickness and reducing the size.