METHOD AND DEVICE FOR STRAIN PROCESSING USING LASER BEAM

摘要

PROBLEM TO BE SOLVED: To provide a strain processing method which can enhance productivity. SOLUTION: Out of the objects 30 for processing which are arranged in plural unit areas No.1-12 to respectively have a strain processing using a laser beam, at least one unit area enters the zone where the strain is measurable by strain measurement device. The unit area within a zone 55 where the strain is measurable by strain measurement device is measured a strain and exposed to laser beam to be given a strain. The objects for processing are shifted while keeping one unit area with a strain given within a zone where the strain is measurable by strain measurement device and having another unit area yet to be exposed to laser beam enter the zone where the strain measurement is possible. One unit area with a strain given and another unit area which enters the zone where the strain is measurable by strain measurement device are measured a strain. The unit area which enters the zone where the strain is measurable by strain measurement device is exposed to laser beam and given a strain.