| 发明名称 |
Rework method for wafers that trigger WCVD backside alarm |
| 摘要 |
A new method is provided to replace tungsten plugs for wafers that trigger the WCVD backside alarm. In this new rework process, the original TiN glue layer is sputter etched back and a new ("fresh") 100-Angstrom thick layer of TiN is deposited. The new tungsten plug is created over the top surface of the refreshed glue layer.
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| 申请公布号 |
US6352924(B1) |
申请公布日期 |
2002.03.05 |
| 申请号 |
US20000587463 |
申请日期 |
2000.06.05 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY |
发明人 |
WU JUN;LEE MING JER;LIN YU KU;WANG YING-LANG |
| 分类号 |
H01L21/768;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/768 |
| 代理机构 |
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