| 摘要 |
A wire saw slicing apparatus capable of slicing a cylindrical workpiece into wafers having a flat shape with reduced bow and warp. The slicing apparatus includes a layer of parallel wires moving with reciprocating or continuous movement while a workpiece is advanced through the wires, while an abrasive containing slurry is supplied. The parallel wires are wound around wire guides, wherein the outer sleeve of the wire guide has a higher thermal coefficient of expansion, and the substructure of the wire guide has a lower thermal coefficient of expansion, with the substructure having flanges at the axial ends that restrict the outer sleeve from expanding axially.
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