CHEMICAL AND MECHANICAL ABRASIVE DEVICE WITH PAD

摘要

PURPOSE: Provided is a chemical and mechanical abrasive device with pad, which can provide smoothly slurry to wafer center in chemical and mechanical grinding and discharge the generated by-product to the direction of edge of wafer. CONSTITUTION: The chemical and mechanical abrasive device comprises a pad which is rotatable and is provided with slurry from the exterior thereof; and a wafer which locates at a distance from center of the pad and is rotatable. In the device, the rotating pad is contacted with the rotating wafer to grind chemically and mechanically the surface of wafer. The pad consists of the first part(25) with the first groove(23), the second part(29) with the second groove(27), the third part(33) with the third groove(31). The first groove(23) and the third groove(31) together form an open path to enable by-product to be discharged.