LEAD FRAME HAVING PERIPHERAL RING PAD AND SEMICONDUCTOR CHIP PACKAGE INCLUDING THE SAME

摘要

PURPOSE: A lead frame having a peripheral ring pad is provided to form a reliable bonding wire in a structure where a die pad is exposed, and to freely dispose inner leads and perform a wire bonding process. CONSTITUTION: A semiconductor chip(20) having an active surface on which a plurality of electrode pads(22) are formed is mounted on the die pad(12). Bonding wires electrically connect the electrode pads with the corresponding inner leads(14). The peripheral ring pad(18) is disposed between the die pad and the inner lead, surrounding the die pad. A tie bar(16) connects the die pad with the peripheral ring pad. The plurality of electrode pads include an electrode pad for power supply. The electrode pad for power supply is electrically connected to the peripheral ring pad by the bonding wire.