发明名称 |
Pattern-block flux deposition |
摘要 |
A method and apparatus are provided for selectively depositing flux on a plurality of flip-chip bumps arranged on a semiconductor by mounting a flux stamp on the semiconductor chip. The flux stamp has a plurality of flux holes arranged in a pattern substantially identically corresponding to the arrangement of the flip-chip bumps of the semiconductor chip. Different flux stamps are prepared for various kinds of semiconductor chips having different flip-chip bump arrangements. Flux is deposited though the flux holes of the flux stamp which selectively exposing the upper surfaces of the flip-chip bumps of the chip, thereby leaving no flux on the chip surface between the flip-chip bumps. |
申请公布号 |
AU7724001(A) |
申请公布日期 |
2002.03.04 |
申请号 |
AU20010077240 |
申请日期 |
2001.07.31 |
申请人 |
ADVANCED MICRO DEVICES INC. |
发明人 |
TERRI J. BROWNFIELD;RAJ N. MASTER |
分类号 |
B23K1/20;B23K3/08;H01L21/60;H05K3/34 |
主分类号 |
B23K1/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|