| 摘要 |
PURPOSE: An apparatus for automatically attaching a chip is provided to remarkably shorten an interval of time taken for a fabricating process, by simultaneously performing a series of processes in an anisotropic conductive film(ACF) attach unit, an integrated circuit(IC) attach unit and a bonding unit. CONSTITUTION: A coating apparatus coats a film on a panel. An IC is pre-attached to the panel coated with the film through an IC loading process, an IC pre-alignment process and a detection process of panel position coordinates and IC position coordinates. An additional head is installed in the respective process positions to perform the respective processes, capable of rotatively transferring so that the above mentioned processes are simultaneously performed. The bonding unit(30) performs a bonding process regarding the panel to which the IC is attached. The first robot for transferring the panel is installed between the coating apparatus and the IC attach unit(20). The second robot for transferring the panel is installed between the IC attach unit and the bonding unit.
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