发明名称 FORMATION OF EMBEDDED CAPACITOR PLANE USING THIN POLYIMIDE DIELECTRIC
摘要 PURPOSE: A polymeric capacitor is provided to enhance a reliability and strength of the capacitor by applying a first dielectric layer onto a surface of a first conductive foil, applying a second dielectric layer onto a surface of a second conductive foil, and then attaching the first and second dielectric layers to one another. CONSTITUTION: A capacitor, which is comprised of a pair of electrically conductive foils(2,4), a pair of dielectric layers(6,6), one dielectric layer being on a surface of each of the foils and the dielectric layers being attached to one another. The dielectric layers have a dielectric strength of at least about 2000 volts per mil thickness. The dielectric layers comprise a material selected from the group consisting of thermosetting polymers, thermoplastic polymers, inorganic materials, and combinations thereof. At least one of the dielectric layers comprises about 100% of an inorganic material.
申请公布号 KR20020016523(A) 申请公布日期 2002.03.04
申请号 KR20010050310 申请日期 2001.08.21
申请人 OAK-MITSUI , INC. 发明人 ANDRESAKIS JOHN A.;SKORUPSKI EDWARD C.;SMITH GORDON;ZIMMERMAN SCOTT
分类号 H01G4/30;H01G4/10;H01G4/18;H01G4/20;H01L25/00;H05K1/16;H05K3/14;(IPC1-7):H01G4/30 主分类号 H01G4/30
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