Methods of forming sputtering targets, and sputtering targets formed thereby

摘要

The invention encompasses a method of forming a sputtering target. A wear profile for a sputtering target surface is determined. The wear profile is utilized to generate a desired profile for a sputtering target sputtering surface. A sputtering target is formed having a sputtering surface with the desired profile. The invention also encompasses a sputtering target having several sputtering domains which reflect the magneti type. The invention also encompasses a sputtering target having a sputtering domain which includes an edge region and a central region. The edge region of the sputtering domain is thicker than the central region.