WIRE BONDING METHOD OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A wire bonding method of a semiconductor package is provided to make the semiconductor package thin and to control a process defect like wire sagging or wire sweeping, not by forming a loop height on a bond pad, but by performing a stitch bonding process. CONSTITUTION: A ball bump(104) is formed on the bond pad(122) of an integrated circuit chip(120) by a capillary on which a wire(106) is mounted. The capillary having the ball bump cuts the wire. The capillary moves to an inner lead(132) of a lead frame corresponding to the bond pad of the integrated circuit chip to perform a ball bonding process. The capillary forms the loop height. The capillary performs the stitch bonding process while moving to the ball bump. The above mentioned processes are repeated regarding another bond pad of the integrated circuit chip and another inner lead of the lead frame.