Capsule construction for flip-chip connected to chip and base has chip stuck onto base using surface adhesive flat encapsulation method, auxiliary chip stuck on to form housing

摘要

The construction uses flip-chip technology to stick the chip to the base and encapsulate it, which increases signal transmission speed and reduces housing height. A main chip (22) is stuck onto the base (21) using a surface adhesive flat encapsulation method. An auxiliary chip (23) with protruding blocks is used to stick onto a chip and simultaneously to the base by the flip-chip method to form a housing.