发明名称 |
Semiconductor device for electric power control, comprising insulator substrate with front-face circuit pattern and rear-face metallic pattern fastened by soldering on metal base |
摘要 |
The device comprises a base plate of metal and at least an insulator substrate (2) comprising an insulator plate (3) with a rear-face pattern (5), and two front-face patterns (4) each in the form of letter L extending parallel to the two sides of the insulator plate. The rear-face pattern (5) is fastened on the base plate by a layer of solder (9). The two front-face patterns are laid out in a centrally symmetric manner and enclose the zones of switching elements (6) which are insulated-gate bipolar transistors (IGBTs) between zones of free-wheel diodes (FWDs) and electrodes. The device comprises two switching elements and two free-wheel diodes laid out in a draught board pattern between two auxiliary electrodes placed along opposite sides of the insulator plate. The insulator plate (3) is of ceramics, the rear-face pattern (5) and the front-face patterns (4) are of copper or aluminium, and the base plate is of copper or aluminium. The switching element zone (6) has a rectangular form of side length greater than 14 mm and is placed in an area 25mm in radius on the front face of the insulator substrate. A temperature sensor is placed on the switching device at a corner, or near the corner (5a) of the rear-face pattern. |
申请公布号 |
FR2813440(A1) |
申请公布日期 |
2002.03.01 |
申请号 |
FR20010004248 |
申请日期 |
2001.03.29 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
FUKADA MASAKAZU;NISHIBORI HIROSHI;YOSHIDA TAKANOBU;YOSHIMATSU NAOKI;KIMOTO NOBUYOSHI;TAKAO HARUO |
分类号 |
H01L25/07;H01L23/538;H01L25/18 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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