| 发明名称 |
Wire bonding apparatus |
| 摘要 |
In a wire bonding apparatus in which a wire is passed through a capillary that is provided at one end of a bonding arm and a damper that holds the wire is disposed directly above the capillary, the distance between the upper surface of the capillary and the undersurface of the damper is set as a very short distance as 1.5 mm or less.
|
| 申请公布号 |
US2002023942(A1) |
申请公布日期 |
2002.02.28 |
| 申请号 |
US20010934890 |
申请日期 |
2001.08.22 |
| 申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
TERAKADO YOSHIMITSU;MOCHIDA TOORU;MII TATSUNARI;SHIOZAWA SHIGERU |
| 分类号 |
H01L21/60;B23K20/00;(IPC1-7):B23K31/02;B23K37/00 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
