POLISHING APPARATUS COMPRISING PAD AND POLISHING METHOD USING THE SAME

摘要

A chemical polishing apparatus which self-supplies a polishing chemical from a polishing pad, and a polishing method using the chemical polishing apparatus are provided. This chemical polishing apparatus, which is used to polish a material film formed on a wafer in the manufacture of semiconductor devices, includes a wafer head, to the bottom surface of which a wafer is sucked, the wafer head capable of uniformly maintaining the temperature of the wafer and a pressure applied to the rear surface of the wafer throughout polishing, a cooling pad which faces the wafer head and self-supplies a polishing chemical during polishing, a cooling vessel which surrounds the bottom and lateral sides of the cooling pad, a cooling unit which is attached to the bottom surface of the cooling pad and used to form and maintain the cooling pad, and a chamber which accommodates the above-described members, and is maintained in a wafer-free state.