LOW PROFILE, HIGH DENSITY MEMORY SYSTEM

摘要

The present invention (50) provides a low profile, high density electronic package (50) for high speed, high performance semiconductors, such as memory devices (28). It includes a plurality of modules having high speed, impedance-controlled transmission line buses, (62) short interconnections between modules and, optionally, driver line terminators built into one of the modules, for maintaining high electrical performance. Suitable applications include microprocessor data buses and memory buses such as RAMBUS and DDR. The modules may be formed on conventional printed circuit cards with unpacked or packed memory chips attached directly to the memory module. Thermal control structures may be included to maintain the high density modules within a reliable range of operating temperature.