| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device by which a substrate can be uniformly heat-treated without causing pattern defects by waste after the substrate is coated with a resist. SOLUTION: In the method, the substrate coated with the resist is successively baked by means of a first heat-treating body equipped with a lower heating body, and a second heat-treating body equipped with upper and lower heating bodies. The device is composed of the first heat-treating body equipped with the lower heating body, the second heat-treating body equipped with the upper and lower heating bodies, and a substrate transporting means. |
