Substrate polishing apparatus and substrate polishing method

摘要

A substrate polishing apparatus wherein semiconductor substrate is held by a top ring 10-2 or 11-2 and is pressed against a polishing surface of a polishing table 10-1 or 10-2. A surface to be polished of the semiconductor substrate is polished by a relative movement between the semiconductor substrate and the polishing surface. The apparatus includes pressing force changing mechanism for changing an pressing force for pressing the semiconductor substrate, relative movement seed changing mechanism for changing the number of revolutions of the top ring and/or the polishing table, and control mechanism. The control mechanism performs the polishing through plural polishing processes on the polishing table 10-1 or 10-2 while changing the pressing force and the number of revolutions.