PIEZOELECTRIC COMPOSITE DEVICE AND METHOD FOR MAKING SAME
摘要
The present invention includes a method of fabricating a piezoelectric composite device comprising steps of (a) disposing a first layer of electrically non-conductive film over the first layer of tape; (b) disposing a first electrically conductive lead over the first layer of electrically non-conductive film; (c) disposing a piezoelectric wafer over the first electrically lead and the first layer of electrically non-conductive film; (d) diposing a second electrically conductive lead over the piezoelectric wafer; (e) disposing a second electrically non-conductive film over the second electrically conductive lead and the wafer, wherein the layers of electrically conductive lead and the wafer, wherein the layers of electrically non-conductive film, the electrically conductive leads, and the wafer form a laminate assembly; and (f) consolidating the laminate assembly at a predetermined temperature and pressure. The present invention also comprises a highly flexible piezoelectric composite device made by a thermoplastic process that consolidates the laminate assembly and forms a hermetic seal.
申请公布号
WO0217407(A2)
申请公布日期
2002.02.28
申请号
WO2001US25898
申请日期
2001.08.17
申请人
THE GOVERNMENT OF THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (NASA)
发明人
HORNER, GARNETT, C.;TETER, JOHN, EDWARD, JR.;ROBBINS, WILLIAM, EUGENE;COPELAND, BENJAMIN, M.