| 摘要 |
<p>A polishing pad having a triangular shape of which vertexes are circular is used as shown in (a). This design is compatible with an idea of scraping off part of the outer periphery of a polishing pad in order to shorten a contact time between the polishing pad and a wafer at the outer periphery of the wafer independently of a rocking speed. As shown in the drawings, a 50mm-diameter circular hollowed-out portion is provided at the center of the polishing pad. When such a polishing pad is used, a rocking width is divided into 10 segments by using the polishing pad under a feasible rocking condition, and products of integrated values of relative linear speeds, integrated values of pressures and integrated values of contact times at respective points inside a wafer plane within respective rocking widths can be set to differ from one another up to +/- 30% to thereby ensure a uniform polishing.</p> |
