发明名称 |
A METHOD FOR THE PREPARATION OF AN EPITAXIAL SILICON WAFER WITH INTRINSIC GETTERING |
摘要 |
This invention is directed to a novel process for the preparation of a silicon wafer comprising a surface having an epitaxial layer deposited thereon. In one embodiment, an epitaxial layer is deposited onto a surface of a silicon wafer. The wafer is also heated to a temperature of at least about 1175 DEG C. This heat treatment begins either during or after the epitaxial deposition. Following the heat treatment, the heated wafer is cooled for a period of time at a rate of at least about 10 DEG C/sec while (a) the temperature of the wafer is greater than about 1000 DEG C, and (b) the wafer is not in contact with a susceptor. In this process, the epitaxial deposition, heating, and cooling are conducted in the same reactor chamber.
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申请公布号 |
WO0077830(A8) |
申请公布日期 |
2002.02.28 |
申请号 |
WO2000US14998 |
申请日期 |
2000.06.01 |
申请人 |
MEMC ELECTRONIC MATERIALS, INC. |
发明人 |
YANG, CHARLES, CHIUN-CHIEH;WATKINS, DARRELL, D. |
分类号 |
H01L21/205;H01L21/322;H01L21/324;(IPC1-7):H01L21/322 |
主分类号 |
H01L21/205 |
代理机构 |
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主权项 |
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地址 |
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